The data shown below were compiled from readership statistics for 28 Mendeley readers of this research output. Click here to see the associated Mendeley record.
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Timeline
Mendeley readers
Title |
Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: Materials and technologies
|
---|---|
Published in |
Journal of Materials Research and Technology, July 2023
|
DOI | 10.1016/j.jmrt.2023.06.193 |
Authors |
T.T. Dele-Afolabi, M.N.M. Ansari, M.A. Azmah Hanim, A.A. Oyekanmi, O.J. Ojo-Kupoluyi, A. Atiqah |
Mendeley readers
Geographical breakdown
Country | Count | As % |
---|---|---|
Unknown | 28 | 100% |
Demographic breakdown
Readers by professional status | Count | As % |
---|---|---|
Student > Ph. D. Student | 4 | 14% |
Researcher | 3 | 11% |
Student > Master | 2 | 7% |
Professor | 1 | 4% |
Unspecified | 1 | 4% |
Other | 1 | 4% |
Unknown | 16 | 57% |
Readers by discipline | Count | As % |
---|---|---|
Materials Science | 5 | 18% |
Engineering | 2 | 7% |
Chemistry | 2 | 7% |
Energy | 1 | 4% |
Unspecified | 1 | 4% |
Other | 0 | 0% |
Unknown | 17 | 61% |