Advanced Driver Assistance Systems and Autonomous Vehicles
Springer Nature Singapore
Chapter title |
Corrosion Mechanisms of Copper and Gold Ball Bonds in Semiconductor Packages
|
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Chapter number | 15 |
Book title |
Advanced Driver Assistance Systems and Autonomous Vehicles
|
Published by |
Springer, Singapore, October 2022
|
DOI | 10.1007/978-981-19-5053-7_15 |
Book ISBNs |
978-9-81-195052-0, 978-9-81-195053-7
|
Authors |
Qin, Wentao |
Country | Count | As % |
---|---|---|
Unknown | 3 | 100% |
Readers by professional status | Count | As % |
---|---|---|
Unspecified | 1 | 33% |
Researcher | 1 | 33% |
Unknown | 1 | 33% |
Readers by discipline | Count | As % |
---|---|---|
Unspecified | 1 | 33% |
Engineering | 1 | 33% |
Unknown | 1 | 33% |