Handbook of Integrated Circuit Industry
Springer Nature Singapore
Chapter title |
Standardization of Integrated Circuits Packaging
|
---|---|
Chapter number | 61 |
Book title |
Handbook of Integrated Circuit Industry
|
Published by |
Springer, Singapore, January 2024
|
DOI | 10.1007/978-981-99-2836-1_61 |
Book ISBNs |
978-9-81-992835-4, 978-9-81-992836-1
|
Authors |
Luo, Le, Wang, Jing, Li, Kun |
Country | Count | As % |
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Unknown | 1 | 100% |
Readers by professional status | Count | As % |
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Student > Master | 1 | 100% |
Readers by discipline | Count | As % |
---|---|---|
Social Sciences | 1 | 100% |