Handbook of Integrated Circuit Industry
Springer Nature Singapore
Chapter title |
Integrated Circuits Packaging Reliability
|
---|---|
Chapter number | 60 |
Book title |
Handbook of Integrated Circuit Industry
|
Published by |
Springer, Singapore, January 2024
|
DOI | 10.1007/978-981-99-2836-1_60 |
Book ISBNs |
978-9-81-992835-4, 978-9-81-992836-1
|
Authors |
Huang, Anjun, Ding, Rongzheng, Xiao, Hanwu, Lu, Jian, Luo, Hongwei |