Handbook of Integrated Circuit Industry
Springer Nature Singapore
Chapter title |
Silicon Wafer Processing
|
---|---|
Chapter number | 75 |
Book title |
Handbook of Integrated Circuit Industry
|
Published by |
Springer, Singapore, January 2024
|
DOI | 10.1007/978-981-99-2836-1_75 |
Book ISBNs |
978-9-81-992835-4, 978-9-81-992836-1
|
Authors |
Yang, Deren, Liang, Xingbo, Yu, Xuegong |
Country | Count | As % |
---|---|---|
Malaysia | 3 | 2% |
United Kingdom | 3 | 2% |
Netherlands | 2 | 1% |
United States | 2 | 1% |
India | 1 | <1% |
Egypt | 1 | <1% |
New Zealand | 1 | <1% |
Spain | 1 | <1% |
China | 1 | <1% |
Other | 0 | 0% |
Unknown | 137 | 90% |
Readers by professional status | Count | As % |
---|---|---|
Student > Ph. D. Student | 49 | 32% |
Student > Master | 28 | 18% |
Student > Bachelor | 19 | 13% |
Researcher | 18 | 12% |
Professor > Associate Professor | 7 | 5% |
Other | 18 | 12% |
Unknown | 13 | 9% |
Readers by discipline | Count | As % |
---|---|---|
Engineering | 71 | 47% |
Physics and Astronomy | 21 | 14% |
Materials Science | 18 | 12% |
Chemistry | 11 | 7% |
Computer Science | 4 | 3% |
Other | 11 | 7% |
Unknown | 16 | 11% |