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Timeline
Chapter title |
Active Packaging: a New Fabrication Principle for High Performance Devices and Systems
|
---|---|
Chapter number | 4 |
Book title |
Future Trends in Microelectronics
|
Published by |
Springer, Dordrecht, January 1996
|
DOI | 10.1007/978-94-009-1746-0_4 |
Book ISBNs |
978-9-40-107280-9, 978-9-40-091746-0
|
Authors |
Serge Luryi, Luryi, Serge |