Materials for High Temperature Digital Electronics
Preprint in arXiv (April 2024)
The most recent citing publications are shown below. View all 8 publications that cite this research output on Dimensions.
Low-temperature joining of alumina ceramic and nickel by Al-Ni self-propagating nanofoil
Article in Ceramics International (November 2023)
Application of Ag-Cu-Ti active metal composite filler in ceramic joining: a review
Article in Frontiers of Materials Science (October 2023)