Heat transfer study of 3D packaging structure with superconducting TSV for practical-scale quantum annealing machines
Article in Japanese Journal of Applied Physics (May 2024)
The most recent citing publications are shown below. View all 52 publications that cite this research output on Dimensions.
Article in Japanese Journal of Applied Physics (May 2024)
Article in Advanced Quantum Technologies (April 2024)
Article in ACM Transactions on Quantum Computing (December 2023)