Modelling thermomechanical degradation of moulded electronic packages using physics-based digital twin

Overview of attention for article published in Microelectronics Reliability, June 2024

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In the top 25% of all research outputs scored by Altmetric
Among the highest-scoring outputs from this source (#22 of 804)
Good Attention Score compared to outputs of the same age (79th percentile)

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Physics-Based Digital Twin of a Thermally Aged Flip-Chip Package (TU Delft, NXP)

Semiconductor Engineering, 29 May 2024

A technical paper titled “Modelling thermomechanical degradation of moulded electronic packages using physics-based digital twin…

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