The data shown below were compiled from readership statistics for 28 Mendeley readers of this research output. Click here to see the associated Mendeley record.
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Timeline
Mendeley readers
| Title |
Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: Materials and technologies
|
|---|---|
| Published in |
Journal of Materials Research and Technology, July 2023
|
| DOI | 10.1016/j.jmrt.2023.06.193 |
| Authors |
T.T. Dele-Afolabi, M.N.M. Ansari, M.A. Azmah Hanim, A.A. Oyekanmi, O.J. Ojo-Kupoluyi, A. Atiqah |
Mendeley readers
Geographical breakdown
| Country | Count | As % |
|---|---|---|
| Unknown | 28 | 100% |
Demographic breakdown
| Readers by professional status | Count | As % |
|---|---|---|
| Student > Ph. D. Student | 4 | 14% |
| Researcher | 3 | 11% |
| Student > Master | 2 | 7% |
| Professor | 1 | 4% |
| Unspecified | 1 | 4% |
| Other | 1 | 4% |
| Unknown | 16 | 57% |
| Readers by discipline | Count | As % |
|---|---|---|
| Materials Science | 5 | 18% |
| Engineering | 2 | 7% |
| Chemistry | 2 | 7% |
| Energy | 1 | 4% |
| Unspecified | 1 | 4% |
| Other | 0 | 0% |
| Unknown | 17 | 61% |