Fiber-to-Chip Packaging With Robust Fiber Fusion Splicing for Low-Temperature Applications

Overview of attention for article published in IEEE Photonics Technology Letters, August 2024

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patent: 2 patents

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Integrated optics quantum weak measurement amplification sensor for remote sensing

Grant US-11815630-B2

United States of America

Integrated optics quantum weak measurement amplification sensor for remote sensing

Grant US-11353562-B2

United States of America

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