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Timeline
Chapter title |
Encapsulating with Loose Microballoons
|
---|---|
Chapter number | 3 |
Book title |
Advances in Electronic Circuit Packaging
|
Published by |
Springer, Boston, MA, January 1965
|
DOI | 10.1007/978-1-4899-7307-8_3 |
Book ISBNs |
978-1-4899-7295-8, 978-1-4899-7307-8
|
Authors |
E. C. Neidel, Neidel, E. C. |